Check out ourPCIM 2022 coverage.
With the Simcenter Micred Quality Tester fromSiemens, engineers can assess a semiconductor package's thermal structure to identify manufacturing defects, including die-attach issues. Precise measurement of thermal response to a short power pulse allows for high-throughput semiconductor testing, including junction-to-case thermal-resistance verification.
Junction temperature measurement is performed via an electrical method using built-inSimcenter Micred T3STERtechnology. As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal-impedance curve and preset bandings of variation.
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