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    • Chip Packaging

    This TechXchange examines chip packaging technology including new advances such as chiplets.
    Editorial

    TechXchange: Chip Packaging
    March 7, 2021
    Packaging: The new dimension of advancement in the semiconductor industry.
    2018beplay

    Chip Packaging Part 1 - Traditional Packaging Technology
    Feb. 19, 2021
    Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods
    2018beplay

    Chip Packaging Part 2 - Introduction to IC Packaging
    Feb. 13, 2021
    Dr. Navid Asadi’s group delves into chip packaging methods including system-in-package (SIP)
    2018beplay

    Chip Packaging Part 3 - Silicon Interposer
    Feb. 12, 2021
    Dr. Navid Asadi’s group examines how silicon interposers are changing chip packaging
    2018beplay

    Chip Packaging Part 4 - 2.5D and 3D Packaging
    Feb. 11, 2021
    Dr. Navid Asadi’s group examines 2.5D and 3D packaging for expanding capabilities and capacities of chip solutions

    More content from Chip Packaging

    2018beplay

    Chip Packaging Part 5 - Chip Production and Manufacturing
    Feb. 8, 2021
    Dr. Navid Asadi’s group examines chip package production
    2018beplay

    Chip Packaging Part 6 - Wafer to Panel Level Packaging
    Feb. 4, 2021
    Navid Asadi博士的小组深入研究圆片规模d panel level chip packaging.
    2018beplay

    Packaging: A 30-Year Career Retrospective
    Nov. 4, 2013
    We’ve come a very long way from the first IC, but we still have a long way yet to go to achieve the full promise of the IC revolution.
    Digital ICs

    Advanced Packaging Delivers Capacity And Performance
    June 20, 2013
    High-density BGAs and 3D stacking increase compute and storage density.
    Baidu